What is Precision Motion Control?Precision motion control is termed as a head in motion control devices and advanced motors that offers a wide range of hybrid steppers, customized rotary & linear motion solutions, motor-blowers, brushless direct-current servo motors lead screw, brushless motor assemblies to conical twin screw barrel operate and maintain the multitude of industrial and engineered control applications. XY Precision Stage comprises three components that are controller, drive, and motor. This is a great way to fulfill the demands of automation and aerospace industries with the utmost ease. We see that precision motion control has also been utilized for electronic components and ultra-precision semiconductor manufacturing.The Wafer front end ProcessWafer front end or wafer fabrication (front-end) is an integrated circuit called a 'die' built on each wafer in a various-step phase. Every process includes fresh layers to the wafer or sometimes changes the existing ones. With the help of layers, the individual electronic circuits make the elements with various scenarios. Wafer handling robots are the best in the business as they offer accuracy as well as repeatability. When wafers are handled manually, there is an increased workload, which can only be solved with the help of wafer handling robots. Wafer handling robots present a logical approach to decrease the manual workload.Current wafer handling robots can pick and place 300mm wafers in a series in a repeated manner. Wafers are picked and placed based on the location of the joint. Wafer handling robots complete the task in an effective manner, which otherwise consumes plenty of time manually. They are extremely accurate and have the ability to complete the task in minimum time. By monitoring the electrical overhead and by safety scanning, collisions are avoided.Wafer handling robots have observed significant advancements throughout the years- high throughput and superior performance are some of the features which make wafer handling robots a favorite of manufacturing firms.The commands are very easy to learn; with some research, they can be self-learned. These robots are equipped to identify fault and recovery, which makes them a preferred choice of manufacturers.Wafer mapping sensors are hassle-free to maintain, easy, and safe to use. These sensors reduce the manufacturing cost to a great extent as they improve efficiency. The assimilated barcode reader or the off-axis reader, along with the direct optical algorithm of the entire involved axis, tends to the recurrence of wafer placement. This trait makes Wafer Cassette Mapping one of the best in the competition. To analyze data wafer handling software is widely used.Types of Precision Motion ControlThere are many types of precision motion control systems available; some of them are discussed below:1. Precision Motion Control Linear Stage For handling everyday machine tasks, the precision motion control linear stage is used in laboratories. It has contactless read-head design, real-time force sensing, and repeatable actions. Apart from that, it comes with a simple structure that you can be operated in silent mode. There is no need to adjust the PID parameters before gaining the super-fast performance.It gives provision to link the backlash with the constant movements. It also has many mechanical controls that you can use to acquire the power-pack performance without worrying about excessive heat. What are the Steps Used in Front End Wafer Fabrication? Photomasking A photomask is a tool used for the production of components - MEMS, displays, semiconductors. With the help of this tool, the manufacturer assigns the pattern of baseplates. In the front-end process, it may be used to maintain the shape of the elements. Etching The second step in the fabrication for die is to separate the thin film material with the help of etching operations. For the etch process, two types of methods used are wet and Dry. Wet etching makes use of the soluble compounds & dry one adopts the gaseous compounds while implementing any tasks. Diffusion Dopants are introduced within the material or may be employed for the expansion of a thin oxide layer onto the wafer. The implantation of wafers requires a high temperature of up to 1200 degrees Celsius in the stage of diffusion. Back-lap Back lap is a front-end wafer fabrication process in which the thickness of wafers is reduced for microcontroller chips. Many times, the system may deposit the thin gold layer on the back of the wafer. Final WordsAre you looking for ways to maximize the operating life of electronic equipment? You can trust Kensington Laboratories, which provides superior quality products that make the manufacturing hassle-free. The fully-functional service of wafer handling robots and precision motion control stage and spare programs by Kensington is all you need.