Polytetrafluoroethylene, commonly known as PTFE or polytetrafluoroethylene, has an inert molecular structure, making it an excellent material for non stick coatings. It can be made into polytetrafluoroethylene printed circuit board. Compared with traditional FR4 materials, PCB manufacturers are increasingly using PTFE laminates because of their unique characteristics in high frequency applications.\r\n\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\t\t\r\n\t\t\t\t\t\t\t\t\tAlthough the manufacturing of PCB made of PTFE is very similar to that of traditional PCB, manufacturers need to be careful when dealing with softer materials, and pay special attention to those areas which are different from PTFE due to their uniqueness, so as to fine tune them. Their process. Nature and chemistry.For example, PTFE laminates are softer than FR4 laminates, and their surfaces are more prone to bending, wrinkling or sagging. Although these surface defects are acceptable in consumer electronic circuits, they will seriously affect the functional performance at high frequency. Therefore, the PTFE laminate needs flat support during storage to prevent sagging or sagging, which will solidify over time.For metallization, marking and multilayer surface treatmentMachining of copper surfaces of PTFE laminates is not recommended. Equipment suitable for conventional rigid materials (e.g., bristles, pumice scrubbers, and composite brushes) should not be used as soft PTFE substrates may stretch to absorb stress, resulting in unpredictable dimensional results.In order to prepare PTFE surface, the standard process used in PCB industry is sodium etchant or plasma gas circulation. These processes can peel or remove fluorine from PTFE surface, making it suitable for metallization, marking and multilayering.To avoid registration problems caused by dimensional stretching, manufacturers use soap or degreasing bath to remove potential organic matter. They also use chemical cleaners to remove the rust preventive coating from the copper foil. This typically removes about one fortieth of an inch from the foil surface to promote photoresist adhesion.The following is teflon pcb fabrication.