PCB hole wall separation refers to the phenomenon of separation or peeling between the metal circuit layer and the hole wall around the drilled hole (or patch hole) of the pad or pin when the PCB (Printed Circuit Board, printed circuit board) is manufactured . It is some tiny cracks formed on the edge of the hole in the printed circuit board PCB. Wireless serial lora moduleUsually, the separation of the hole wall is caused by process or material problems. This phenomenon may cause a short circuit between signal layers or a short circuit between layers of the PCB board, affecting the performance of the circuit, thereby affecting the normal function of the PCB.The separation of the hole wall of the PCB board will cause the electronic components to be unable to be fixed on the PCB board, thus affecting the use of the PCB board. Common reasons are as follows:PCB board material problem: If the material of the PCB board is not hard enough or not flexible enough, cracks or breaks may appear around the pads or pin holes.PCB board design problem: If the PCB board design is unreasonable, such as the size of the hole is too small or the distance between the holes is too close, etc., it may also cause the separation of the hole wall.Production process problems: production process problems may be one of the main causes of hole wall separation. For example, if the temperature of the PCB board is too high or the time is too long, it may cause the material of the PCB board to be damaged, thereby causing the separation of the hole wall.Problems with the welding process: If the welding process is improper, such as at too high a temperature or for too long, it may also cause the hole wall to separate. In addition, if the welding material used is of poor quality or insufficient quantity, it may also cause the hole wall to separate.The main reason for the separation of PCB hole walls is the mechanical stress and thermal stress during the manufacturing process. During the process of manufacturing PCB boards, Wireless modem holes are drilled through by mechanical drills or lasers. During this process, the material around the hole wall is subjected to mechanical and thermal stress, so tiny cracks may occur. If these cracks are not treated correctly, they can grow and eventually cause the hole walls to separate.
